Russia’s modern precision weapons have long relied on imported microelectronics. Investigations into missiles, drones, guided aerial bombs, electronic warfare systems, and combat aircraft have consistently revealed the presence of Western-designed semiconductors and, more recently, commercially available Chinese components.
The Oreshnik missile represents a notable departure from this pattern. Rather than relying predominantly on foreign-made electronics, the recovered remnants indicate extensive use of low- and medium-complexity semiconductors manufactured by Russian and Belarusian companies.
This report seeks to map the recovered semiconductor components, their manufacturers, production periods, and the sanctions status of these producers, providing new insight into the domestic industrial base supporting Russia’s newest strategic missile system.
The analysis is based on information collected by Ukrainian military experts during forensic examinations of the instrument compartments recovered from the remnants of two Oreshnik missile strikes, conducted following the attacks in November 2024 and January 2026. The documented findings were subsequently reviewed and verified by NAKO.
The report does not represent a comprehensive technical assessment of the entire missile. Rather, it analyzes only those components that were recovered, documented, and identified from the available debris, providing a component-level assessment of the missile’s observable architecture and supply chain.